Functional materials and devices
Product 1: Al-based silicon carbide composite
Product Features
The vertical integration from powder ratio to product design are fully covered;
The performance can be customized as per requirements;
High stability, low cost
Product 2: Thermal conductive material
Product Features
Encapsulation material
Copper aluminum clad, high material utilization
Laser cooling plate, unique structural design, low stress, high reliability
Double/multi-layer (copper/aluminum/steel/titanium/nickel) clad (coil/sheet)
Extremely ultra-thin to 0.03mm
Ultra-strong VC heating plate
Ultra thin VC heating plate material
Extensive experience in manufacturing
One-stop development from material to device
Strong adaptability and high reliability
Product customization
Product 3: Fiberglass-free high-frequency copper-clad plate
Product Features
Low dielectric constant
Low dielectric loss tangent
low-expansion coefficient
Excellent dimensional stability
Excellent thermal conductivity
Good heat resistance
Product 4: Copper diamond composite
Product Features
Thermal conductivity far exceeds its counterpart of traditional heat dissipation materials, reaching 600 -1000 W/(m·K).
Low coefficient of thermal expansion provides superior compatibility with the chip, significantly mitigating thermal deformation in high-power applications.
Customized service: diamond volume and copper layer thickness, etc.
